Grinding Wheel Size 300 x 25 x 76.2 Mm Od x Thick x Bore Resin Bonded Diamond Wheel... Tender

DEFENCE RESEARCH AND DEVELOPMENT ORGANISATION (DRDO) has floated a tender for Grinding Wheel Size 300 x 25 x 76.2 Mm Od x Thick x Bore Resin Bonded Diamond Wheel Grade D300 T25 x 10 D151 B75tn69 H76.2 Wd (Quantity Required: 8 Numbers). The project location is Hyderabad, Telangana, India. The reference number is GEM/2023/B/3677773 and it is closing on 01 Aug 2023. Suppliers can request Register free of cost to get the complete Tender details and download the document.

Expired Tender

Procurement Summary

State : Telangana

Summary : Grinding Wheel Size 300 x 25 x 76.2 Mm Od x Thick x Bore Resin Bonded Diamond Wheel Grade D300 T25 x 10 D151 B75tn69 H76.2 Wd (Quantity Required: 8 Numbers)

Deadline : 01 Aug 2023

Other Information

Notice Type : Tender

TOT Ref.No.: 85594334

Document Ref. No. : GEM/2023/B/3677773

Competition : NCB

Financier : Self Financed

Purchaser Ownership : Public

Document Fees : Refer Document

Tender Value : Refer Document

EMD : Refer Document

Purchaser's Detail

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Tender Details

Item Description: GRINDING WHEEL SIZE 300 x 25 x 76.2 MM OD x THICK x BORE RESIN BONDED DIAMOND WHEEL GRADE D300 T25 x 10 D151 B75TN69 H76.2 WD
BOQ Title: BOQ19
Item Title: Grinding Wheel Size 300 x 25 x 76.2 Mm Od x Thick x Bore Resin Bonded Diamond Wheel Grade D300 T25 x 10 D151 B75tn69 H76.2 Wd
Item Quantity: 8
Unit of Measure: Numbers
Delivery Period (In number of days): 120
Start Date: 12-07-2023 2:22 PM
End Date: 01-08-2023 11:00 AM

Documents

 Tender Notice

Bid_Document_5016539.pdf

Specification_Document.pdf

BOQ_Document.csv


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