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CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY has floated a tender for Tungsten Carbide Die and Punch, Qty: 1. The project location is Hyderabad, Telangana, India. The reference number is GEM/2024/B/4669294 and it is closing on 02 Mar 2024. Suppliers can request Register free of cost to get the complete Tender details and download the document.
Procurement Summary
State : Telangana
Summary : Tungsten Carbide Die and Punch, Qty: 1
Deadline : 02 Mar 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 97382719
Document Ref. No. : GEM/2024/B/4669294
Competition : NCB
Financier : Self Financed
Purchaser Ownership : Public
Document Fees : Refer Document
Tender Value : Refer Document
EMD : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Tungsten Carbide Die and Punch (Q3)
Quantity Required: 1
Start Date: 21-02-2024 4:41 PM
End Date: 02-03-2024 5:00 PM
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