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SEMI-CONDUCTOR LABORATORY (SCL) has floated a tender for Wafer Bumping Service. The project location is Rupnagar, Punjab, India. The reference number is SCL/PS/44989/APD/05/2024 and it is closing on 04 Mar 2024. Suppliers can request Register free of cost to get the complete Tender details and download the document.
Procurement Summary
State : Punjab
Summary : Wafer Bumping Service
Deadline : 04 Mar 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 96806581
Document Ref. No. : SCL/PS/44989/APD/05/2024
Competition : ICB
Financier : Self Financed
Purchaser Ownership : Public
Document Fees : Refer Document
Tender Value : Refer Document
EMD : Refer Document
Purchaser's Detail
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Address : Login to see tender_details
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Login to see detailsTender Details
Wafer Bumping Service
Miscellaneous Services
Tender ID : 2024_SCL_794863_1
Tender Category : Services
Product Category : Miscellaneous Services
Sub category : NA
Form Of Contract : Supply
Contract Type : Tender
Bid Validity(Days) : 120
Period Of Work(Days) : 60
Document Download / Sale Start Date : 13-Feb-2024 02:00 PM
Document Download / Sale End Date : 04-Mar-2024 03:00 PM
Bid Submission End Date : 04-Mar-2024 03:00 PM
Bid Opening Date : 05-Mar-2024 03:00 PM
EMD Amount in ₹ : 0.00
Tender Value in ₹ : NA
Tender Fee in ₹ : 0.00
Documents
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