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Global Equipotential Bonding Tenders and GPN from across the Globe

TendersOnTime provides latest updates on Global Equipotential Bonding Tenders, Contract Awards and various other opportunities related to Equipotential Bonding. The information on Equipotential Bonding tenders is collected from various sources viz: government tenders portal, tender bulletin and public procurement websites.

Groundwater Protection Bond

Deadline: 29 May 2026

Korea, Republic Of(South Korea)

Deadline: 29 May 2026

TOT Reference No.: 51790954

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Groundwater Protection Bond

Deadline: 29 May 2026

Korea, Republic Of(South Korea)

Deadline: 29 May 2026

TOT Reference No.: 55892150

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Procurement of a Wafer Bonding System

Deadline: 12 Apr 2025

Germany

Deadline: 12 Apr 2025

TOT Reference No.: 99923013

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Tech Licensing Opportunity: Advanced Bonding Method for Heterogeneous Systems

Deadline: 01 Jul 2025

United States of America

Deadline: 01 Jul 2025

TOT Reference No.: 103565716

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Acquisition of Bond Sheets, Recycled Sheets for Printing External Financing Projects, Municipality

Deadline: 22 Apr 2025

Bolivia (Plurinational State of)

Deadline: 22 Apr 2025

TOT Reference No.: 100172382

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Transient Earth Bonding Unit to Achive Equipotential Bonding, Qty: 1 Pieces, (BOQ Item #8)

Deadline: 09 Jul 2024

India

Deadline: 09 Jul 2024

TOT Reference No.: 102855743

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With A View To Executing The Work Plan And Budget - Pato Section Bonder Sp/Ms - Front. Brazil/Bolivia

Deadline: 17 Aug 2025

Brazil

Deadline: 17 Aug 2025

TOT Reference No.: 90577414

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Equipotential Earth Bar, Qty: 2 No, (BOQ Item #13)

Deadline: 16 Aug 2024

India

Deadline: 16 Aug 2024

TOT Reference No.: 104898458

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Transient Earth Bonding, Qty: 1 Job, (BOQ Item #6)

Deadline: 05 Jul 2024

India

Deadline: 05 Jul 2024

TOT Reference No.: 103032059

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Transient Earth Bonding, Qty: 1 Job, (BOQ Item #6)

Deadline: 16 Aug 2024

India

Deadline: 16 Aug 2024

TOT Reference No.: 105529639

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