200 Mm Wafer Prober Incl. Temperature Testing - Pr874550 Tender, Germany - 114173801

Procurement Summary

Country : Germany

Summary : 200 Mm Wafer Prober Incl. Temperature Testing - Pr874550

Deadline : 06 Mar 2025

Other Information

Notice Type : Tender

TOT Ref.No.: 114173801

Document Ref. No. : 75700-2025

Competition : ICB

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

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Tender Details

1 Piece. This specification describes the requirements for a wafer probing system to be used for characterization and test engineering for sensor ICs at the Fraunhofer IIS. The system must allow handling of 200 mm and 300 mm wafers. The focus in the usage of the machine does not depend on short handling time and high throughput, but on accuracy in probing and possibility for stimulation of optical and magnetical sensors. For stimulation of optical sensors a darkened DuT chamber is mandatory. The Wafer Chuck has to be made off non-magnetic metarials to prevent distortion while characterizing magnetic field sensors. Options: 2.1Installing ConditionsAC Voltage (prefered specifications)230 V 50 Hz, 16 A fuse 3.3Wafer probingOptional: Wafer thickness200 µm-1600 µm 3.4Wafer probingColor camera for wafer alignmentYes 4.2Wafer ChuckOptional: Minimum temperature-60 °C 5.5LoadingOptional: Wafer ID-Reading for text with standard and non-standard fontsRating: 100% for YES, 20% for NO 9.1Electrical Interface and remote controlInterface GPIB (IEEE-488) Yes 13.1ServiceAfter expiration of warranty a service contract for at least 3 yearsYes

Doc Title: 200 mm Wafer Prober incl. Temperature Testing - PR874550

Contract Type: supplies
Document Type: Contract Notice
Reference Number: PR874550
Contract Type: supplies
Authority Type: pub-undert
Doc Title: 200 mm Wafer Prober incl. Temperature Testing - PR874550
Dispatch Date: 2025-02-03
Publish Date: 2025-02-04
Submission Date: 2025-03-06

Documents

 Tender Notice