Procurement Summary
Country : Switzerland
Summary : A Packaging Machine for Integrating Photonic Integrated Circuits
Deadline : 20 May 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 99924828
Document Ref. No. : 217847-2024
Competition : ICB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
In 2024, EPFL intends to acquire a packaging machine for the integration of photonic integrated circuits for its laboratory LPQM. The devices will be dedicated to cutting-edge research in the fields of integrated photonics and MEMS: the goal is the complete integration of photonics
Document Type: Contract Notice
Reference Number: 278577-
Contract Type: supplies
Authority Type: body-pl
Doc Title: A packaging machine for the integration of photonic integrated circuits
Dispatch Date: 2024-04-11
Publish Date: 2024- 04-12
Submission Date: 2024-05-20
Documents
Tender Notice