A Packaging Machine for the Integration of Photonic Integrated Circuits Ecole Polytechnique... Tender

Procurement Summary

Country : Switzerland

Summary : A Packaging Machine for the Integration of Photonic Integrated Circuits Ecole Polytechnique Fédérale De Lausanne (epfl) Laboratory of Photonic and Quantum Measurements (lpqm)

Deadline : 20 May 2024

Other Information

Notice Type : Tender

TOT Ref.No.: 99867096

Document Ref. No. : 1411109

Competition : ICB

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

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Tender Details

In 2024, the EPFS intends to acquire a packaging machine for the integration of photonic integrated circuits for your LPQM laboratory. Devices will be dedicated to top research in the areas of integrated photonics and MEMS: The goal is the complete integration of photonic components through techniques of fiber To-chip-bonings, the fiber array-to-chip-bonings and the butterfly package using active alignment and in-situ tests both optical and electro-optical properties. The system is fully automatic with an active alignment system and relies on soldering and adhesives. The packaging machine must also contain the following functionalities: see specification.
Demand/awarding authority: Ecole Polytechnique Fédérale de Lausanne (EPFL) procurement site/organizer: Ecole Polytechnique Fédérale de Lausanne (EPFL) Laboratory of Photonic and Quantum Measurements (LPQM), to HDN. by Professor Tobias J. Kippenberg, Bâtiment PH - Station 03, 1015 Lausanne, Switzerland, phone: 0216931111, email: marta.divall@epfl.ch
Publish Date: 10.04.2024
Procurement object
2.1 Type of the delivery order: purchase
2.2 Project title of procurement: A packaging machine for the integration of photonic integrated circuits
2.3 File number / project number: 2402-23723
2.4 Division in lots?: No
2.5 Community vocabulary:
2.6 The subject and scope of the order: In 2024, the EPFS intends to acquire a packaging machine for the integration of photonic integrated circuits for your LPQM laboratory. The devices will be dedicated to top research in the areas of integrated photonics and MEMs: The goal is the complete integration Photonic components through techniques of the fiber-to-chip-bondings, the fiber array-to-chip-bonings and the butterfly package using active alignment and in-situ tests both optical and electro-optical properties. The system is fully automatic with an active alignment system and relies on soldering and adhesives. The packaging machine must also contain the following functionalities: see specification. 2.7 Place of delivery: S ...

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