A Packaging Tool for the Integration of Integrated Photonic Circuits Ecole Federal... Tender

Procurement Summary

Country : Switzerland

Summary : A Packaging Tool for the Integration of Integrated Photonic Circuits Ecole Federal Polytechnic of Lausanne (epfl) Laboratory of Photonic and Quantum Measurements (lpqm)

Deadline : 20 May 2024

Other Information

Notice Type : Tender

TOT Ref.No.: 99867094

Document Ref. No. : 1411105

Competition : ICB

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

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Tender Details

In 2024, the EPFL intends to acquire a packaging tool for the integration of integrated photonic circuits for LAB LPQM. Equipment will be dedicated to peak search in the field of integrated photonics and MEMS : The objective is to fully integrate photonic devices by fiber collage techniques on chip, bonding fiber network on chip, “butterfly” packaging, while using active alignment and in situable test of properties Optics and electro-optics. The system is fully automated with an active alignment system and is based on welding and adhesives. The photonic clipping must also include the features listed in the annexed document.
Applicant service/contracting entity: Ecole Polytechnique Fédérale de Lausanne (EPFL) Organizing Organizing Organizing Service: Federal Polytechnic School of Lausanne (EPFL) Laboratory of Photonic and Quantum Measurements (LPQM), for the attention of Professor Tobias J. KIPPENBERG, Building PH - Station 03, 1015 Lausanne, Switzerland, telephone: 0216931111, e -mail: mart.divall@epfl.ch
Publish Date: 10.04.2024
Subject of the market
2.1 Gender of supplies: Purchase
2.2 Market project title: a packaging tool for the integration of integrated photonic circuits
2.3 Reference / Project number: 2402-23723
2.4 Market divided in lots?: No
2.5 Common vocabulary of public procurement:
2.6 Object and extent of the market: In 2024, the EPFL intends to acquire a packaging tool for the integration of integrated photonic circuits for Lab LPQM. Equipment will be dedicated to peak search in the field Integrated photonics and MEMs: the objective is to completely integrate photonic devices by fiber collage techniques on chip, collage of fiber networks on chip, “butterfly” packaging, while using active alignment and the in situ test of optical and electro-optical properties. The system is fully automated with an active alignment system and is based on welding and adhesives. The photonic clipping must also include the features listed in the annexed document. br ...

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