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FRAUNHOFER-GESELLSCHAFT - EINKAUF B12 has floated a tender for Analytic-Prober (Ipms-Mrs11.4)Analytic-Prober (Ipms-Mrs11.4) - Pr863933-2480-P. The project location is Germany and the tender is closing on 31 Mar 2025. The tender notice number is 139985-2025, while the TOT Ref Number is 115658231. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country : Germany
Summary : Analytic-Prober (Ipms-Mrs11.4)Analytic-Prober (Ipms-Mrs11.4) - Pr863933-2480-P
Deadline : 31 Mar 2025
Other Information
Notice Type : Tender
TOT Ref.No.: 115658231
Document Ref. No. : 139985-2025
Competition : ICB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
1 piece Analytic-Prober Automated wafer prober to be used for electro-optical test. This "Analytic Prober" will be used for contacting (probing) MEMS and OLED semiconductor wafers and bare dies (e.g. QMI - chiplets) in a CMOS compatible cleanroom according to class 4 EN ISO 14644-1 production environment. It must offer enough free space above the contacted DUT to place there several optical measuring devices precisely and permanently. Optional service items: 1.5General Tool DescriptionAppropriate measures have been taken to prevent electrostatic charging of the DUTs.YES 2.1.3Wafer ChuckExchangeable surface addonYES 2.1.17Wafer ChuckOptionally: electrical discharge of the chuck: A device that temporarily discharges the chuck automatically before & during wafer loadingYES 2.1.27Wafer ChuckOptionally: For x-Y-Theta alignment alternative (additional) user-defined targets are possible, in case of first target is missing on DUT.YES 2.2.15Probing, Probe Card, Probe CleaningOptionally: automatical probe mark inspection - using the the above mentioned top-down camera on the currently loaded DUTYES 2.3.1.3automatically loaded 200mm wafersOptionally: 200mm wafers can have a notch at a transparent wafer edge (e.g. a diameter-reduced CMOS wafer is bonded onto a 200mm glass wafer with a notch at the glass edge). Please refer to figure 6.YES 2.3.1.7automatically loaded 200mm wafers"Optionally: extended min. possible thickness for automatically loaded 200mm wafers is ≤ 400µm "YES 2.3.1.8aut...
Document Type: Contract Notice
Reference Number: PR863933-2480-P
Contract Type: supplies
Authority Type: pub-undert
Doc Title: Analytic-Prober (IPMS-MRS11.4)Analytic-Prober (IPMS-MRS11.4) - PR863933-2480-P
Dispatch Date: 2025-02-28
Publish Date: 2025-03-03
Submission Date: 2025-03-31
Documents
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