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Automated Endpoint Detection of Copper Electrodeposition in Through-Silicon Vias... Tender

ENERGY, DEPARTMENT OF has floated a tender for Automated Endpoint Detection of Copper Electrodeposition in Through-Silicon Vias (Tsvs). The project location is USA and the tender is closing on 31 May 2024. The tender notice number is 24_05, while the TOT Ref Number is 100450507. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.

Procurement Summary

Country : USA

Summary : Automated Endpoint Detection of Copper Electrodeposition in Through-Silicon Vias (Tsvs)

Deadline : 31 May 2024

Other Information

Notice Type : Tender

TOT Ref.No.: 100450507

Document Ref. No. : 24_05

Competition : ICB

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

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Tender Details

Description

Background Information:

For 3D, and heterogeneous integration (HI) of microelectronics devices, void-free copper (Cu)-filled TSVs are a critical technology. Cu overburden or over-plating, typically resulting from excess Cu electroplating on the surface often included to overcome process marginality, requires subsequent removal steps, generally by chemical mechanical polishing (CMP). In general, more overburden requires longer CMP resulting in a loss of throughput and a higher consumption of consumable chemistries and polishing pads.

Utilizing current and voltage transient signatures during the electrochemical deposition, Sandia has developed and filed for patent protection on automated endpoint detection methods which indicate when deposition has reached the top of the TSV features. Automation software allows for increased process monitoring and control. Terminating deposition based on electrical data features results in vias with minimal Cu overburden. By reducing the time-consuming processing steps and providing automated process control, this endpoint detection method has potential to greatly enhance microelectronics manufacturing.

Technology Highlights:

Improves manufacturing repeatability. Improves throughput and decreases consumable costs Relatively geometry independent - minimizing setup time for large work-mix manufacturers Endpoint signals are relatively insensitive to chemical changes - allowing improved process marginality to changes in the plating electrolyte over time.

Potential Applications:

Semiconductor manufacturers and packaging vendors High bandwidth memory manufacturers Advanced packaging suppliers

Opportunity Description:

SNL is seeking partners to further develop and commercialize the TSV endpoint detection. Licensing and technical support (paid by Licensee) are available.

Sandia National Laboratories is a multimission laboratory managed and operated by National Technolog...
Active Contract Opportunity Notice ID 24_05 Related Notice Department/Ind. Agency ENERGY, DEPARTMENT OF Sub-tier ENERGY, DEPARTMENT OF Office NTESS, LLC - DOE CONTRACTOR
General Information
Contract Opportunity Type: Special Notice (Original)
All Dates/Times are: (UTC-06:00) MOUNTAIN STANDARD TIME, DENVER, USA
Original Published Date: Apr 24, 2024 10:31 am MDT
Original Response Date: May 31, 2024 11:59 pm MDT
Inactive Policy: 15 days after response date
Original Inactive Date: Jun 15, 2024
Initiative:
Classification
Original Set Aside:
Product Service Code:
NAICS Code: 54171 - Research and Development in the Physical, Engineering, and Life Sciences

Place of Performance: Albuquerque, NM 87123 USA