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KYUNGPOOK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION has floated a tender for Buy Wafer Wire Bonding Machine. The project location is South Korea and the tender is closing on 20 Feb 2024. The tender notice number is 20240222096-00, while the TOT Ref Number is 97095350. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country : South Korea
Summary : Buy Wafer Wire Bonding Machine
Deadline : 20 Feb 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 97095350
Document Ref. No. : 20240222096-00
Competition : NCB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : KRW 58000000
Purchaser's Detail
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Login to see detailsTender Details
Buy wafer wire bonding machine
Reference number: Semiconductor Specialization University Business Group-11
Allocation budget: KRW 63, 800, 000
Estimated price: KRW 58, 000, 000
(Value-added tax: KRW 5, 800, 000)
Bidding start date: 2024/02/19 10:00:00
Bidding closing date: 2024/ 02/20 10:00:00e5de163d51c4c382d83d4bcdcc430e25
Documents
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