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CHONBUK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION has floated a tender for Buy Wafer Wire Bonding Machine. The project location is South Korea and the tender is closing on 16 Aug 2024. The tender notice number is 20240808582-00, while the TOT Ref Number is 105497624. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country : South Korea
Summary : Buy Wafer Wire Bonding Machine
Deadline : 16 Aug 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 105497624
Document Ref. No. : 20240808582-00
Competition : NCB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : KRW 68181818
Purchaser's Detail
Name :xxxxxxxxx
Address : xxxxxxxxx
Email : xxxxxxxxx
Login to see detailsTender Details
Buy wafer wire bonding machine
Reference number: Research Support Office-5259
Allotted budget: KRW 75, 000, 000
Estimated price: KRW 68, 181, 818
(Value-added tax: KRW 6, 818, 182)
Bidding start date: 2024/08/09 10:00:00
Bidding closing date: 2024/08/ 16 10:00:00e5de163d51c4c382d83d4bcdcc430e25
Documents
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