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IHP GMBH - LEIBNIZ INSTITUTE FOR INNOVATIVE MICROELECTRONICS has floated a tender for Chip to Wafer Bonder. The project location is Germany and the tender is closing on 20 Feb 2024. The tender notice number is 40215-2024, while the TOT Ref Number is 95477275. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country : Germany
Summary : Chip to Wafer Bonder
Deadline : 20 Feb 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 95477275
Document Ref. No. : 40215-2024
Competition : ICB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Dyson V15s Detect SubmarineTM Nass- und Trockensauger
Chip to Wafer Bonder
Doc Title: Chip to Wafer Bonder
Contract Type: supplies
Document Type: Contract Notice
Reference Number:
Documents
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