Procurement Summary
Country : Finland
Summary : Distributed Acoustic Sensing (Das) and Distributed Temperature and Strain Sensing (Dtss) Devices
Deadline : 22 Nov 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 108299879
Document Ref. No. : 604642-2024
Competition : ICB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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GENERAL Please note that this is a prior information notice (hereinafter referred to as 'the notice') and that this notice is not yet a call for tenders. The information provided in this notice is preliminary and may change as the preparation progresses. The aim is to publish the final call for tenders by the end of the year 2024. THE SUBJECT-MATTER OF THE PROCUREMENT Geological Survey of Finland (GTK) is planning to acquire one (1) Distributed Acoustic Sensing device (DAS) and on (1) Distributed Temperature and Strain Sensing device (DTSS). Purpose of the devices is to monitor tailings dam with fiber optic cables using distributed acoustic sensing and distributed strain and temperature sensing interrogators. GTK has installed the fiber optic cables in different layers to research dam-s structures, to prevent damages and to seek possible leakages. Monitorings are going to be done by DAS and DTSS interrogators. We want to measure passive seismic methods and strain sensing. Measuring temperature differences is optional. REGISTRATION AND QUESTION TO POTENTIAL TENDERERS Interested companies are invited to send their contact details by e-mail to kilpailutus@hansel.fi with the subject line "GTK: DAS and DTSS". The personal data of the registered persons will only be used for contacts related to this upcoming procurement. In the registration e-mail, we ask you to: - provide brochures of the DAS and DTSS devices - answer the following questions 1) Are you able to offer both DAS...
Document Type: Prior Information Notice
Reference Number: GTK/619/02.03.01/2024
Contract Type: supplies
Authority Type: cga
Doc Title: Distributed Acoustic Sensing (DAS) and Distributed Temperature and Strain Sensing (DTSS) devices
Dispatch Date: 2024-10-04
Publish Date: 2024-10-08
Submission Date: 2024-11-22
Documents
Tender Notice