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TAMPERE UNIVERSITY OF APPLIED SCIENCES SR has floated a tender for Flip-Chip Bonder. The project location is Finland and the tender is closing on 01 Mar 2025. The tender notice number is TAU/4783/2024, while the TOT Ref Number is 115037495. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country : Finland
Summary : Flip-Chip Bonder
Deadline : 01 Mar 2025
Other Information
Notice Type : Tender
TOT Ref.No.: 115037495
Document Ref. No. : TAU/4783/2024
Competition : ICB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Tampere University Foundation sr ('TAU') is inviting tenders for'Flip-chip bonder'.A die bonder for mounting optoelectronic components epilayer structure down on substrates having pre-deposited Indium or eutectic (Gold-rich) AuSn solder. System must have at least passive alignment tools (i.e., the
Disclaimer : Submission date not Mentioned in this Notice so we can assume date of publication date.
Documents
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