Procurement Summary
Country : Germany
Summary : Fully Automatic Wafer-To Wafer Bonder - Pr408678-3460-W
Deadline : 06 Nov 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 92323759
Document Ref. No. : 673486-2023
Competition : ICB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Fully Automatic Wafer-to Wafer Bonder
Doc Title: Fully Automatic Wafer-to Wafer Bonder - PR408678-3460-W
Contract Type: supplies
Document Type: Contract Notice
Reference Number: LOT-0000
Contract Type: supplies
Doc Title: Fully Automatic Wafer-to Wafer Bonder - PR408678-3460-W
Dispatch Date: 2023-11-03
Publish Date: 2023-11-06
Submission Date: 2024-11-06
Documents
Tender Notice