High-Temperature In-Situ (HTIS) Indenter Tender, USA - 110108342

Procurement Summary

Country : USA

Summary : High-Temperature In-Situ (HTIS) Indenter

Deadline : 27 Nov 2024

Other Information

Notice Type : Tender

TOT Ref.No.: 110108342

Document Ref. No. : NIST-SS25-CHIPS-0025

Competition : ICB

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

Name :Login to see tender_details

Address : Login to see tender_details

Email : Login to see tender_details

Login to see details

Tender Details

Description

The purpose of this sources sought notice is to conduct market research and identify potential sources of commercial products/services that satisfy the Government-s anticipated needs.



BACKGROUND



The National Institute of Standards and Technology (NIST), Material Measurement Laboratory (MML), Materials Measurement Science Division (MMSD), Nanomechanical Properties Group (https://www.nist.gov/mml/mmsd/nanomechanical-properties-group) determines and disseminates key data to establish the relationship between structure, property, and performance of materials and devices to address current and future needs in semiconductor microelectronics, energy conversion applications, climate research, and additive manufacturing.

For this project, NIST is aiming to study the deformation behavior and measure mechanical properties (e.g., modulus, creep, yield stress, fracture toughness) of materials (such as, dielectrics and metals) and structures relevant to the semiconductor industry (such as, film stacks and dies). The described mechanical characterization using instrumented indentation will be performed under vacuum conditions at temperatures ranging from room temperature (RT) to 350°C. Furthermore, in-situ observation of the indentation-induced deformation and damages (e.g., cracking, delamination) will be conducted during indentation experiments.

These high-temperature mechanical tests under vacuum conditions can be accomplished by operating an instrumented indentation device specifically designed for high-temperature (HT) testing inside a scanning electron microscope (SEM).

The HT in-situ (HTSI) indenter will be predominately installed and operated in a FEI Quanta 200 FEG ESEM. However, the HTSI indenter may also be occasionally installed and operated in a JEOL 7800 or JEOL 7100.

NIST is seeking information from sources that may be capable of providing a solution that shall achieve the objectives described above, in addition to t...
Active Contract Opportunity
Notice ID : NIST-SS25-CHIPS-0025
Related Notice
Department/Ind. Agency : COMMERCE, DEPARTMENT OF
Sub-tier : NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
Office: DEPT OF COMMERCE NIST
General Information
Contract Opportunity Type: Sources Sought (Original)
Original Published Date: Nov 13, 2024 12:13 pm EST
Original Response Date: Nov 27, 2024 11:00 am EST
Inactive Policy: 15 days after response date
Original Inactive Date: Dec 12, 2024
Initiative: None

Classification
Original Set Aside:
Product Service Code: 6640 - LABORATORY EQUIPMENT AND SUPPLIES
NAICS Code: 334513 - Instruments and Related Products Manufacturing for Measuring, Displaying, and Controlling Industrial Process Variables

Place of Performance: Gaithersburg, MD 20899 USA

Documents

 Tender Notice