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FUDAN UNIVERSITY has floated a tender for Integrated Chip Eda Design University Planning Software Package. The project location is China and the tender is closing on 28 Sep 2021. The tender notice number is 0705-214020202861, while the TOT Ref Number is 57077410. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country : China
Summary : Integrated Chip Eda Design University Planning Software Package
Deadline : 28 Sep 2021
Other Information
Notice Type : Tender
TOT Ref.No.: 57077410
Document Ref. No. : 0705-214020202861
Competition : ICB
Financier : Self Financed
Purchaser Ownership : -
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Project Name: Integrated chip EDA design university planning software package
Tenders are invited for Integrated Chip Eda Design University Planning Software Package
Products List:
1: Integrated Chip Eda Design University Planning Software Package
Place of Implementation: Shanghai, China
Beginning of Selling Bidding Documents: 2021-09-06
Ending of Selling Bidding Documents: 2021-09-13
Price of Bidding Documents: ￥0/$0
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time): 2021-09-28 10:00
Documents
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