Procurement Summary
Country : USA
Summary : Maintenance for Flip Chip Bonding Tool
Deadline : 28 Apr 2021
Other Information
Notice Type : Tender
TOT Ref.No.: 52544636
Document Ref. No. : 80NSSC211517
Competition : ICB
Financier : Self Financed
Purchaser Ownership : -
Tender Value : Refer Document
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Login to see detailsTender Details
Maintenance for Flip Chip Bonding Tool
Active Contract Opportunity
Notice ID : 80NSSC211517
Related Notice
Department/Ind. Agency : NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Sub-tier : NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Office : NASA SHARED SERVICES CENTER
General Information
Contract Opportunity Type: Presolicitation (Original)
All Dates/Times are: (UTC-04:00) EASTERN STANDARD TIME, NEW YORK, USA
Original Published Date: Apr 23, 2021 10:55 am EDT
Original Response Date: Apr 28, 2021 12:00 pm EDT
Inactive Policy: 15 days after response date
Original Inactive Date: May 13, 2021
Initiative: None
Classification
Original Set Aside: Total Small Business Set-Aside (FAR 19.5)
Product Service Code: R499 - SUPPORT- PROFESSIONAL: OTHER
NAICS Code: 541990 - All Other Professional, Scientific, and Technical Services
Place of Performance: Greenbelt, MD 20771 USA
Description
NASA/NSSC has a requirement for preventative maintenance contract covering our FC150 Flip Chip Bonder. These systems contain proprietary software designed specifically for the equipment.
NASA/NSSC intends to issue a sole source contract to JB TECHNICAL SUPPORT SERVICE 3020 E CLARENDON AVE PHOENIx ARIZONA 85016-7015 under the authority of FAR 13.106-1(b)(1)(i). The personnel performing this work must be appropriately trained on the specific systems, have availability of parts specific to the Goddard-owned e...
Documents
Tender Notice