Micro specimens of thin film electroplated copper and micro-sized lead-free solder... Tender

Procurement Summary

Country : USA

Summary : Micro specimens of thin film electroplated copper and micro-sized lead-free solder for mechanical testing to fracture

Deadline : 14 Mar 2025

Other Information

Notice Type : Tender

TOT Ref.No.: 115196121

Document Ref. No. : NIST-SS25-21

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

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Description

NIST-SS25-21

PLEASE NOTE THIS A SOURCES SOUGHT NOTICE ONLY

Title: Micro specimens of thin film electroplated copper and micro-sized lead-free solder for mechanical testing to fracture.

BACKGROUND

The Applied Chemicals and Materials Division, in the Material Measurement Laboratory at NIST, is developing new metrology to measure the micromechanical properties, to fracture, of thin-film electroplated copper (Cu) and micro-sized lead-free solder. These materials are critical as interconnects for heterogeneous integration for advanced packaging. Cu is used for Cu-to-Cu hybrid bonding, the most advanced interconnect technology today and in the near future, while Sn-Ag-Cu (SAC) solder is used for all levels of packaging. The packaging industry relies on physics-based models and finite element models to predict the thermomechanical performance of these interconnects as well as to guide their design and process development and understand reliability-related issues. Such models require accurate material property data as inputs. Mechanical property data, to fracture, are lacking or sparse for these materials with size scales, chemical composition and microstructure similar to that of the interconnects. The characteristic length for Cu hybrid bonds is 1 micron, and that of solder can range from 1 micron to over 100 microns. Common practice is to use material property data measured from samples of Cu and/or solder that are dissimilar in size scales and/or with dissimilar microstructures from those used in Cu hybrid bonding and solder bumping, but such data is not accurate due to the effects of size, processing and microstructure on the properties. A state-of-the-art technique is to use nanoindentation to measure mechanical properties, however, nanoindentation tests are typically not to fracture, especially for ductile materials such as metals. NIST is therefore developing new measurement tools and techniques to measure various mechanical propertie...
Active Contract Opportunity
Notice ID : NIST-SS25-21
Related Notice
Department/Ind. Agency : COMMERCE, DEPARTMENT OF
Sub-tier : NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
Office: DEPT OF COMMERCE NIST
General Information
Contract Opportunity Type: Sources Sought (Original)
Original Published Date: Feb 21, 2025 02:38 pm EST
Original Response Date: Mar 14, 2025 05:00 pm EDT
Inactive Policy: 15 days after response date
Original Inactive Date: Mar 29, 2025
Initiative: None

Classification
Original Set Aside:
Product Service Code: AJ12 - GENERAL SCIENCE AND TECHNOLOGY R&D SERVICES; GENERAL SCIENCE AND TECHNOLOGY; APPLIED RESEARCH
NAICS Code: 5417 - Scientific Research and Development Services

Place of Performance: Gaithersburg, MD 20899 USA

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