Multi-Chip Module Packaging of SiC Pressure Sensors and Electronics Tender, USA - 106093812

Procurement Summary

Country : USA

Summary : Multi-Chip Module Packaging of SiC Pressure Sensors and Electronics

Deadline : 23 Aug 2024

Other Information

Notice Type : Tender

TOT Ref.No.: 106093812

Document Ref. No. : 80NSSC24881222Q

Competition : ICB

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

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Tender Details

Description

**SOLE SOURCE REQUIREMENT** FOR

Multi-Chip Module Packaging of SiC Pressure Sensors and Electronics
Active Contract Opportunity
Notice ID : 80NSSC24881222Q
Related Notice
Department/Ind. Agency : NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Sub-tier : NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Office: NASA SHARED SERVICES CENTER
General Information
Contract Opportunity Type: Special Notice (Original)
All Dates/Times are: (UTC-05:00) CENTRAL STANDARD TIME, CHICAGO, USA
Original Published Date: Aug 20, 2024 07:14 am CDT
Original Response Date: Aug 23, 2024 09:00 am CDT
Inactive Policy: 15 days after response date
Original Inactive Date: Sep 07, 2024
Initiative: None

Classification
Original Set Aside:
Product Service Code: H181 - QUALITY CONTROL- CONTAINERS, PACKAGING, AND PACKING SUPPLIES
NAICS Code: 334419 - Other Electronic Component Manufacturing

Place of Performance: Cleveland, OH 44135 USA

Documents

 Tender Notice

SATPC0036443-Tab-06-RDSS.pdf

SATPC0036443-Tab-07-Capability-Statement-SAM.pdf

SATPC0036443-Tab-04-4-SOW.pdf