NOTICE OF INTENT TO SOLE SOURCE for Extreme Thermal Cycling Chamber Tender, USA - 116156196

Procurement Summary

Country : USA

Summary : NOTICE OF INTENT TO SOLE SOURCE for Extreme Thermal Cycling Chamber

Deadline : 23 Mar 2025

Other Information

Notice Type : Tender

TOT Ref.No.: 116156196

Document Ref. No. : ACQ0042339

Competition : ICB

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

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Tender Details

Description

Notice of Intent to Noncompetitively acquire an extreme thermal cycling chamber

This notice is not a request for a quotation. A solicitation document will not be issued, and quotations will not be requested.

This acquisition is being conducted under the authority of FAR 13.106-1(b). The North American Industry Classification System (NAICS) code for this acquisition is 334413, Semiconductor Devices and Associated Hardware which has a small business size standard of 1, 250 employees.The National Institute of Standards and Technology (NIST) Infrastructure and Materials Group within Engineering Laboratory (EL) is seeking an extreme thermal cycling chamber to perform accelerated aging experiments as part of a study of long-term reliability of materials used in advanced packaging of semiconductor chips. This work is in support of the CHIPS Metrology program.

In support of the CHIPS Metrology program, reliability testing and modeling of polymeric components in advanced packaging for semiconductors will be studied and developed. These materials will include underfill epoxies, thermal interface materials, and redistribution layer components. Extensive material property characterization of these components and their interfacial properties during environmental exposure (e.g., temperature, humidity, thermal cycling) will be completed for accurate reliability modeling development. Inverse gas chromatography will be used to measure shifts in work of adhesion throughout the aging process as part of this work. The work of adhesion of films (and particulates as needed) will be measured on samples throughout the aging process. These properties will also be measured in samples under variable temperature and relative humidity to investigate the effects of these environmental factors on work of adhesion throughout the aging process.

The CHIPS Metrology program develops and advances cutting edge metrology capabilities for members of the US semiconductor man...
Active Contract Opportunity
Notice ID : ACQ0042339
Related Notice
Department/Ind. Agency : COMMERCE, DEPARTMENT OF
Sub-tier : NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY :
General Information
Contract Opportunity Type: Special Notice (Original)
Original Published Date: Mar 12, 2025 03:47 pm EDT
Original Response Date: Mar 23, 2025 04:00 pm EDT
Inactive Policy: 15 days after response date
Original Inactive Date: Apr 07, 2025
Initiative: None

Classification
Original Set Aside:
Product Service Code: 5961 - SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE
NAICS Code: 334413 - Semiconductor and Related Device Manufacturing

Place of Performance: Gaithersburg, MD 20899 USA

Documents

 Tender Notice