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NATIONAL AERONAUTICS AND SPACE ADMINISTRATION has floated a tender for Packaging of On-Chip Integrated Silicon Carbide Pressure and Micro-Tc Sensors. The project location is USA and the tender is closing on 02 Mar 2022. The tender notice number is 80NSSC794425Q, while the TOT Ref Number is 63811476. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country : USA
Summary : Packaging of On-Chip Integrated Silicon Carbide Pressure and Micro-Tc Sensors
Deadline : 02 Mar 2022
Other Information
Notice Type : Tender
TOT Ref.No.: 63811476
Document Ref. No. : 80NSSC794425Q
Competition : ICB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Packaging of on-chip integrated silicon carbide pressure and micro-TC sensors
Active Contract Opportunity
Notice ID : 80NSSC794425Q
Related Notice
Department/Ind. Agency : NATIONAL AERONAUTICS AND SPACE ADMINISTRATION : :
General Information
Contract Opportunity Type: Special Notice (Original)
All Dates/Times are: (UTC-06:00) CENTRAL STANDARD TIME, CHICAGO, USA
Original Published Date: Feb 25, 2022 03:20 pm CST
Original Response Date: Mar 02, 2022 04:00 pm CST
Inactive Policy: 15 days after response date
Original Inactive Date:
Initiative: None
Classification
Original Set Aside:
Product Service Code: 9390 - MISCELLANEOUS FABRICATED NONMETALLIC MATERIALS
NAICS Code: 541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
Place of Performance: Cleveland, OH 44135 USA
Description
NASA/NSSC has a requirement for Packaging of on-chip integrated silicon carbide pressure and micro-TC sensors.
NASA/NSSC intends to issue a sole source contract to Sienna Technologies, Inc., 19501 144th Avenue NE, Suite F-500 Woodinville, WA 98072-4423, under the authority of FAR 13.106-1(b)(1)(i). It has been determined that Sienna Technologies, Inc. is the sole provider of the Packaging of on-chip integrated silicon carbide pressure and micro-TC sensors.
NASA/NSSC will be the procuring center for this effort. Performance will be located a...
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