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The MPG SEMICONDUCTOR LABORATORY has issued a Tender notice for the procurement of a Procurement of a Wafer Bonding System in the Germany. This Tender notice was published on 12 Apr 2024 and is scheduled to close on 12 Apr 2025, with an estimated Tender value of Refer Document. Interested bidders can access detailed Tender information, eligibility criteria, and complete bidding documents by referencing TOT Ref No. 99923013, while the tender notice number is 217457-2024 and Registering on the platform.
Procurement Summary
Country: Germany
Summary: Procurement of a Wafer Bonding System
Deadline: 12 Apr 2025
Posting Date: 12 Apr 2024
Other Information
Notice Type: Tender
TOT Ref.No.: 99923013
Document Ref. No.: 217457-2024
Financier: Self Financed
Purchaser Ownership: Public
Tender Value: Refer Document
Purchaser's Detail
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Login to see detailsTender Details
This procurement concerns the
•Mechanical, thermal and electrical connection of externally produced user-specific integrated circuits (ASICs) with the highly specialized internally developed and manufactured radiation sensors
•Heterogeneous integration of photonic and electrical
Document Type: Prior Information Notice
Reference Number: 09-2024_VV
Contract Type: supplies
Authority Type: org-sub
Doc Title: Beschaffung einer Wafer Bonding Anlage
Dispatch Date: 2024-04-11
Publish Date: 2024-04-12
Submission Date: 2025-04-12
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