Procurement Summary
Country : China
Summary : Solder Paste Printing
Deadline : 11 Apr 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 99109639
Document Ref. No. : 0664-2440SUMECA74/11
Competition : ICB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Project Name: Solder paste printing
Tenders are invited for Bao2 Wet Cleaning Machine
Products List:
1: Wet Cleaning Machine
2: Wet Cleaning Machine
3: Foup Cleaning Machine
4: Wafer Bottom Filling and Dispensing Machine
5: Ultrasonic Scanning Microscope (Sat)
6: Wafer Cutting Machine
7: Uf Dispensing Machine
8: Package Level Sat (C-Scan&T-Scan)
9: Laser Mark
10: Solder Paste Printing
11: Smt Patch
12: Planting Ball Machine
13: Plant Ball Feeding Machine
14: Wafer Back Side Marking
Place of Implementation: beijing
Beginning of Selling Bidding Documents: 2024-03-20
Ending of Selling Bidding Documents: 2024-03-27
Price of Bidding Documents: ¥800/$100
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time): 2024-04-11 10:00
Documents
Tender Notice