Home » Tenders » Asia » China » Solder Paste Printing Inspection Spi Equipment Tender, China - 99833986

Solder Paste Printing Inspection Spi Equipment Tender, China - 99833986

BEIJING XINLI TECHNOLOGY INNOVATION CENTER CO., LTD. has floated a tender for Solder Paste Printing Inspection Spi Equipment. The project location is China and the tender is closing on 30 Apr 2024. The tender notice number is 0664-2440SUMECA91/14, while the TOT Ref Number is 99833986. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.

Procurement Summary

Country : China

Summary : Solder Paste Printing Inspection Spi Equipment

Deadline : 30 Apr 2024

Other Information

Notice Type : Tender

TOT Ref.No.: 99833986

Document Ref. No. : 0664-2440SUMECA91/14

Competition : ICB

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

Name :Login to see tender_details

Address : Login to see tender_details

Email : Login to see tender_details

Tender Details

Project Name: Solder paste printing inspection SPI equipment

Tenders are invited for Bao1 X-Ray Fluorescence Coating Thickness Gauge

Products List:
1: X-Ray Fluorescence Coating Thickness Gauge
2: Automatic Wafer Conveyor
3: Wafer Bonding Machine
4: Base Plate Machine Equipment
5: Substrate Transfer Machine Equipment
6: Glue Dispensing Equipment
7: Cladding Machine
8: Microwave Plasma Processor
9: Open Circuit Testing Machine
10: Open Circuit Tester Os
11: Wafer X-Ray
12: X-Ray Equipment
13: Flux Detects Aoi Devices
14: Solder Paste Printing Inspection Spi Equipment
15: Inverted Welding Automatic Detection Equipment
16: Inverted Welding Automatic Detection Equipment

Place of Implementation: beijing

Beginning of Selling Bidding Documents: 2024-04-09

Ending of Selling Bidding Documents: 2024-04-17

Price of Bidding Documents: ￥800/$100

Deadline for Submitting Bids/Time of Bid Opening (Beijing Time): 2024-04-30 14:00