Procurement Summary
Country : China
Summary : Solder Paste Printing Inspection Spi Equipment
Deadline : 30 Apr 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 99833986
Document Ref. No. : 0664-2440SUMECA91/14
Competition : ICB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
Name :Login to see tender_details
Address : Login to see tender_details
Email : Login to see tender_details
Login to see detailsTender Details
Project Name: Solder paste printing inspection SPI equipment
Tenders are invited for Bao1 x-Ray Fluorescence Coating Thickness Gauge
Products List:
1: x-Ray Fluorescence Coating Thickness Gauge
2: Automatic Wafer Conveyor
3: Wafer Bonding Machine
4: Base Plate Machine Equipment
5: Substrate Transfer Machine Equipment
6: Glue Dispensing Equipment
7: Cladding Machine
8: Microwave Plasma Processor
9: Open Circuit Testing Machine
10: Open Circuit Tester Os
11: Wafer x-Ray
12: x-Ray Equipment
13: Flux Detects Aoi Devices
14: Solder Paste Printing Inspection Spi Equipment
15: Inverted Welding Automatic Detection Equipment
16: Inverted Welding Automatic Detection Equipment
Place of Implementation: beijing
Beginning of Selling Bidding Documents: 2024-04-09
Ending of Selling Bidding Documents: 2024-04-17
Price of Bidding Documents: ¥800/$100
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time): 2024-04-30 14:00
Documents
Tender Notice