Sources Sought Notice for High-Speed, Distributable Monte Carlo Simulation for SEM-based... Tender

Procurement Summary

Country : USA

Summary : Sources Sought Notice for High-Speed, Distributable Monte Carlo Simulation for SEM-based Overlay Metrology

Deadline : 28 Feb 2025

Other Information

Notice Type : Tender

TOT Ref.No.: 114816914

Document Ref. No. : NIST-SS25-CHIPS-0066

Competition : ICB

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

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Tender Details

Description

The NIST Physical Measurement Laboratory (PML), Microsystems and Nanotechnology Division (MND), CHIPS R&D Program (https://www.nist.gov/chips/metrology-community) as part of the CHIPS Act activities (Grand Challenge 5: Modeling and Simulating Semiconductor Manufacturing Processes), is now developing imaging and measurement solutions for integrated circuit (IC) overlay metrology using a scanning electron microscope (SEM). IC production relies on measurements of the 3D size, shape, and placement of structures with atomic-level precision and repeatability. The project, titled “SEM Overlay Metrology Based on Physics Model and Artificial Intelligence, ” will create a sound scientific foundation and comprehensive solutions for SEM-based overlay and dimensional metrology superior to currently used arbitrary methods. This will allow the design of overlay patterns, acquisition, and image analysis to be optimized entirely through artificial intelligence, physics-based simulation, and modeling and meet IC production requirements now and in the future. For this work, samples that contain patterns used for overlay measurements and relevant to current IC technologies are indispensable.



NIST is seeking information from sources that may be capable of providing a commercial solution that will achieve the objectives described above, in addition to the following essential requirements:



NIST MND requires high-speed, distributable Monte Carlo software (MC SW) suitable for SEM-based measurements of IC overlay structures by accurately simulating and modeling the electron-solid interactions and generating images for artificial (AI) metrology solutions. For this, high-speed generation of secondary and backscattered images using the physics of signal generation is indispensable. The MC SW must be implemented in the NIST CPU Cluster.



Sophisticated, 3D sample geometry, material definition, and visualization by graphical user interface Many shape pri...
Active Contract Opportunity
Notice ID : NIST-SS25-CHIPS-0066
Related Notice
Department/Ind. Agency : COMMERCE, DEPARTMENT OF
Sub-tier : NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
Office: DEPT OF COMMERCE NIST
General Information
Contract Opportunity Type: Sources Sought (Original)
Original Published Date: Feb 14, 2025 10:25 am EST
Original Response Date: Feb 28, 2025 11:00 am EST
Inactive Policy: 15 days after response date
Original Inactive Date: Mar 15, 2025
Initiative: None

Classification
Original Set Aside:
Product Service Code: 7A20 - IT AND TELECOM - APPLICATION DEVELOPMENT SOFTWARE (PERPETUAL LICENSE SOFTWARE)
NAICS Code: 513210 - Software Publishers

Place of Performance: Gaithersburg, MD 20899 USA

Documents

 Tender Notice