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RIKEN has floated a tender for Super Conduction Laminated Structural Research Package Board Implementation Device. The project location is Japan and the tender is closing on 04 Sep 2024. The tender notice number is , while the TOT Ref Number is 105836922. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country : Japan
Summary : Super Conduction Laminated Structural Research Package Board Implementation Device
Deadline : 04 Sep 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 105836922
Document Ref. No. :
Competition : ICB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Tenders are invited for Super Conduction Laminated Structural Research Package Board Implementation Device
Bid Deadline: 2024-09-04
Bid Opening Date: 2024-09-13
[Disclaimer: The above text is machine translated. For accurate information kindly refer the original document.]
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