Procurement Summary
Country : France
Summary : Supply of Slimming Equipment "wafer to Wafer" and "die to Wafer"
Deadline : 01 Mar 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 96090606
Document Ref. No. : B24-00389-MC
Competition : ICB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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Login to see detailsTender Details
Supply of slimming equipment "WAFER TO WAFER" and "DIE TO WAFER"
Subject: Supply of slimming equipment "Wafer to Wafer" and "Die to Wafer"
Public entity: other organizations
CPV code: 31712100
Purchase entity: AO / CEA / CEA / Grenoble - Center de Grenoble
Announcement type: consultation ad
Main category: supplies
Documents
Tender Notice