Procurement Summary
Country : Germany
Summary : Test Head with Cards and Manipulator - Pr876327-2440-P
Deadline : 27 Mar 2025
Other Information
Notice Type : Tender
TOT Ref.No.: 115375725
Document Ref. No. : 129543-2025
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : Refer Document
Purchaser's Detail
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1 Piece. This specification describes the requirements for a semiconductor test system to be used for characterization and test of sensor ICs at the Fraunhofer IIS. The system must provide intefaces that allow connection with a wafer probing system and a Pick-and-Place handler. The system has to be compatible in Hard- and Software to an already existing Advantest V93000 test system in the Fraunhofer-Gesellschaft. Options Installation Conditions AC voltage (preferred specification) Supply-Channels (High Power) Channel count Extendable to at least Supply-Channels (High Power) Extendable voltage range capability per channel (continuous) Supply-Channels (High Power) Extendable voltage range capability per channel (continuous) Supply-Channels (High Resolution) Channel count extendable to at least AWG/Digitizer (High Resolution) AWG Channel count extendable to at least (single-ended/differential) AWG/Digitizer (High Resolution) Digitizer Channel count extendable to at least (single-ended/differential) AWG/Digitizer (High Speed) AWG Channel count extendable to at least (single-ended/differential) AWG/Digitizer (High Speed) Digitizer Channel count extendable to at least (single-ended/differential) Utility I2C-Interface Utility SPI-Interface Interface Cable interface to Pick-and-Place handler interface board: Ability for establishing an appropiate cable interface meeting all other specifications of this document Interface Supplier can provide stiffener for testhead interface for PCB (...
Document Type: Contract Notice
Reference Number: PR876327-2440-P
Contract Type: supplies
Authority Type: pub-undert
Doc Title: Test head with cards and manipulator - PR876327-2440-P
Dispatch Date: 2025-02-24
Publish Date: 2025-02-26
Submission Date: 2025-03-27
Documents
Tender Notice