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Wafer Bonding Machine Tender, China - 99402693

BEIJING XINLI TECHNOLOGY INNOVATION CENTER CO., LTD. has floated a tender for Wafer Bonding Machine. The project location is China and the tender is closing on 18 Apr 2024. The tender notice number is 0664-2440SUMECA91/03, while the TOT Ref Number is 99402693. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.

Procurement Summary

Country : China

Summary : Wafer Bonding Machine

Deadline : 18 Apr 2024

Other Information

Notice Type : Tender

TOT Ref.No.: 99402693

Document Ref. No. : 0664-2440SUMECA91/03

Competition : ICB

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

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Tender Details

Project Name: Wafer bonding machine

Tenders are invited for Bao1 X-Ray Fluorescence Coating Thickness Gauge

Products List:
1: X-Ray Fluorescence Coating Thickness Gauge
2: Automatic Wafer Conveyor
3: Wafer Bonding Machine
4: Base Plate Machine Equipment
5: Substrate Transfer Machine Equipment
6: Glue Dispensing Equipment
7: Cladding Machine
8: Microwave Plasma Processor
9: Open Circuit Testing Machine
10: Open Circuit Tester Os
11: Wafer X-Ray
12: X-Ray Equipment
13: Flux Detects Aoi Devices
14: Solder Paste Printing Inspection Spi Equipment
15: Inverted Welding Automatic Detection Equipment
16: Inverted Welding Automatic Detection Equipment

Place of Implementation: beijing

Beginning of Selling Bidding Documents: 2024-03-28

Ending of Selling Bidding Documents: 2024-04-07

Price of Bidding Documents: ￥800/$100

Deadline for Submitting Bids/Time of Bid Opening (Beijing Time): 2024-04-18 10:00