BEIJING XINLI TECHNOLOGY INNOVATION CENTER CO., LTD. has floated a tender for Wafer Bonding Machine. The project location is China and the tender is closing on 18 Apr 2024. The tender notice number is 0664-2440SUMECA91/03, while the TOT Ref Number is 99402693.
Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.