Home » Tenders » Americas » USA » Wafer Bonding System Tender, USA - 105078054

Wafer Bonding System Tender, USA - 105078054

DEPT OF DEFENSE has floated a tender for Wafer Bonding System. The project location is USA and the tender is closing on 09 Aug 2024. The tender notice number is N0017324RFIMB23, while the TOT Ref Number is 105078054. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.

Procurement Summary

Country : USA

Summary : Wafer Bonding System

Deadline : 09 Aug 2024

Other Information

Notice Type : Tender

TOT Ref.No.: 105078054

Document Ref. No. : N0017324RFIMB23

Competition : ICB

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

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Tender Details

Description

See attched RFI/Sources Sought and Technical Specifications
Active Contract Opportunity Notice ID N0017324RFIMB23 Related Notice Department/Ind. Agency DEPT OF DEFENSE Sub-tier DEPT OF THE NAVY Major Command ONR Sub Command ONR NRL Office NAVAL RESEARCH LABORATORY
General Information
Contract Opportunity Type: Sources Sought (Original)
All Dates/Times are: (UTC-04:00) EASTERN STANDARD TIME, NEW YORK, USA
Original Published Date: Jul 31, 2024 02:49 pm EDT
Original Response Date: Aug 09, 2024 04:00 pm EDT
Inactive Policy: 15 days after response date
Original Inactive Date: Aug 24, 2024
Initiative: None

Classification
Original Set Aside:
Product Service Code: 6640 - LABORATORY EQUIPMENT AND SUPPLIES
NAICS Code: 334516 - Analytical Laboratory Instrument Manufacturing

Place of Performance: Washington, DC 20375 USA