Procurement Summary
Country : United Kingdom
Summary : Wafer Dicing Saw and Post Wafer Cleaning
Deadline : 28 May 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 100471461
Document Ref. No. : 2024UoS-1289
Competition : ICB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : GBP 205000
Purchaser's Detail
Name :Login to see tender_details
Address : Login to see tender_details
Email : Login to see tender_details
Login to see detailsTender Details
Title : Wafer Dicing Saw and Post Wafer Cleaning
Location Of Contract : South East
Industry : Laboratory, optical and precision equipments (excl. glasses) - 38000000
Value Of Contract : £205, 000
Description : The University of Southampton seeks to acquire a complete dicing system for the University's optical and semiconductor materials processing capabilities for a number of high-impact projects in the major engineering themes of Quantum Technologies, Photonics and Advanced Manufacturing.This system is a replacement for the current dicing saw for Building 53 back-end of line cleanroom facility and an upgrade to meet the demands of current projects and technologies. Dicing is a fundamental part of the cleanroom and underpins a significant number of ongoing and future grants. The acquisition of this system will enable university researchers to machine surfaces and micron sized ridge structures with nanoscale surface roughness and low amounts of topside chipping in optical and semiconductor materials.This dicing machine will allow the fabrication of new devices that will tackle fundamental research problems in quantum light-matter interactions, quantum sensors, and telecommunications.How to obtain Tender Documents:Website: https://in-tendhost.co.uk/universityofsouthampton/aspx/HomeThe Tender documents can be access when logged into In-Tend by selecting 'View Details' on the relevant tender advert and c licking the 'Express In...
Documents
Tender Notice