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Wafer Reflow Welder - Die Bond Tender, China - 97908871

BEIJING XINLI TECHNOLOGY INNOVATION CENTER CO., LTD. has floated a tender for Wafer Reflow Welder - Die Bond. The project location is China and the tender is closing on 21 Mar 2024. The tender notice number is 0664-2440SUMECA44/07, while the TOT Ref Number is 97908871. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.

Procurement Summary

Country : China

Summary : Wafer Reflow Welder - Die Bond

Deadline : 21 Mar 2024

Other Information

Notice Type : Tender

TOT Ref.No.: 97908871

Document Ref. No. : 0664-2440SUMECA44/07

Competition : ICB

Financier : Self Financed

Purchaser Ownership : Public

Tender Value : Refer Document

Purchaser's Detail

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Tender Details

Project Name: Wafer Reflow Welder - DIE BOND

Tenders are invited for Bao2 Wet Cleaning Machine (Glue Removal)

Products List:
1: Wafer Sputtering (Ticu)
2: Wet Cleaning Machine (Glue Removal)
3: Wet Etching Machine
4: Automatic Optical Inspection Equipment (Aoi)
5: Wafer Aoi
6: Wafer Reflow Welder Fo
7: Wafer Reflow Welder - Die Bond
8: Flux Water Washing Machine (After Cow Flux Cleaning)
9: Solder Flux Washing Machine
10: Heat Dissipation Cover Adhesive Mounting Machine (High-Precision Mounting Machine)
11: Automatic Optical Inspection Equipment (Aoi)
12: Final Inspection Testing Machine

Place of Implementation: beijing

Beginning of Selling Bidding Documents: 2024-02-29

Ending of Selling Bidding Documents: 2024-03-07

Price of Bidding Documents: ￥800/$100

Deadline for Submitting Bids/Time of Bid Opening (Beijing Time): 2024-03-21 13:30