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KOREA INSTITUTE OF CERAMIC TECHNOLOGY has floated a tender for Wafer Wire Bonding Machine. The project location is South Korea and the tender is closing on 20 Aug 2024. The tender notice number is 20240810440-00, while the TOT Ref Number is 105630402. Bidders can have further information about the Tender and can request the complete Tender document by Registering on the site.
Procurement Summary
Country : South Korea
Summary : Wafer Wire Bonding Machine
Deadline : 20 Aug 2024
Other Information
Notice Type : Tender
TOT Ref.No.: 105630402
Document Ref. No. : 20240810440-00
Competition : NCB
Financier : Self Financed
Purchaser Ownership : Public
Tender Value : KRW 44700000
Purchaser's Detail
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Login to see detailsTender Details
wafer wire bonding machine
Reference number: Korea Institute of Ceramic Engineering and Technology Announcement No. 202408-25 (b)
Allocation budget: KRW 49, 170, 000
Estimated price: KRW 44, 700, 000
(Value-added tax: KRW 4, 470, 000)
Bidding start date: 2024/08/12 18:00:00
Bidding deadline: 2024/08/20 10:00:00e5de163d51c4c382d83d4bcdcc430e25
Documents
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